Specification
| Basic Information |
| Supported CPU |
AMD Socket AM5, support for : AMD Ryzen 7000 Series Processors |
| Chipset |
AMD X670 |
| BIOS |
1 x 256 Mbit flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 |
| Form Factor |
E-ATX Form Factor; 30.5cm x 26.9cm |
| Audio |
Realtek ALC1220-VB CODEC * The front panel line out jack supports DSD audio. ESS ES9118 DAC chip Support for DTS:X® Ultra High Definition Audio 2/4/5.1-channel * You can change the functionality of an audio jack using the audio software. To configure 5.1-channel audio, access the audio software for audio settings. Support for S/PDIF Out |
| Expansion Slots |
| PCI |
CPU: 1 x PCI Express x16 slot, supporting PCIe 5.0* and running at x16 (PCIEX16) * Actual support may vary by CPU. * The M2B_CPU and M2C_CPU slots share bandwidth with the PCIEX16 slot. When the M2B_CPU or M2C_CPU slot is populated, the PCIEX16 slot operates at up to x8 mode. * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot. Chipset: 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x4 (PCIEX4) 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x2 (PCIEX2) Support for AMD CrossFire technology (PCIEX16 and PCIEX4) |
| Memory |
| Type |
DDR5 |
| Slots |
4 DIMMs |
| Supported Memory |
Support for DDR5 6600(OC) / 6400(OC) / 6200(OC) / 6000(OC) / 5600(OC) / 5200 / 4800 / 4400 MT/s memory modules Dual channel memory architecture Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for AMD EXtended Profiles for Overclocking (AMD EXPO™) and Extreme Memory Profile (XMP) memory modules |
| Maximum Memory |
Up to 128 GB (32 GB single DIMM capacity) of system memory |
| Graphics |
| Graphics |
Integrated Graphics Processor: 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz * Support for HDMI 2.1 version and HDCP 2.3. ** Support native HDMI 2.1 TMDS compatible ports. 1 x DisplayPort, supporting a maximum resolution of 3840x2160@144 Hz * Support for DisplayPort 1.4 version and HDR. |
| Connector & Ports |
| HDMI |
1 x HDMI port |
| Display Port (s) |
1 x DisplayPort |
| USB (s) |
CPU: 1 x USB Type-C port on the back panel, with USB 3.2 Gen 2 support 2 x USB 3.2 Gen 2 Type-A ports (red) on the back panel CPU + USB 2.0 Hub: 4 x USB 2.0/1.1 ports on the back panel Chipset: 2 x USB Type-C ports, with USB 3.2 Gen 2x2 support (1 port on the back panel, 1 port available through the internal USB header) 4 x USB 3.2 Gen 2 Type-A ports (red) on the back panel 4 x USB 3.2 Gen 1 ports available through the internal USB headers 4 x USB 2.0/1.1 ports available through the internal USB headers |
| LAN Port (s) |
Marvell AQtion AQC113C 10GbE LAN chip (10 Gbps/5 Gbps/2.5 Gbps/1 Gbps/100 Mbps) |
| Wireless Communication module |
Wireless Communication module Intel Wi-Fi 6E AX210 WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands BLUETOOTH 5.3 Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate (Actual data rate may vary depending on environment and equipment.) |
| Supported Storage |
CPU: 1 x M.2 connector (Socket 3, M key, type 25110/2280 PCIe 5.0* x4/x2 SSD support) (M2A_CPU) * Actual support may vary by CPU. 3 x M.2 connectors (Socket 3, M key, type 22110/2280 PCIe 5.0* x4/x2 SSD support (M2B_CPU/M2C_CPU/M2D_CPU) * Actual support may vary by CPU. Chipset: 6 x SATA 6Gb/s connectors |
| RAID |
RAID 0, RAID 1, and RAID 10 support for NVMe SSD storage devices RAID 0, RAID 1, and RAID 10 support for SATA storage devices |
| Audio |
2 x audio jacks |
| Internal I/O Ports |
1 x 24-pin ATX main power connector 2 x 8-pin ATX 12V power connectors 1 x CPU fan header 1 x water cooling CPU fan header 4 x system fan headers 4 x system fan/water cooling pump headers 2 x addressable LED strip headers 2 x RGB LED strip headers 1 x CPU cooler LED strip/RGB LED strip header 4 x M.2 Socket 3 connectors 6 x SATA 6Gb/s connectors 1 x front panel header 1 x front panel audio header 1 x USB Type-C header, with USB 3.2 Gen 2x2 support 2 x USB 3.2 Gen 1 headers 2 x USB 2.0/1.1 headers 1 x noise detection header 1 x THB_U4 add-in card connector 1 x power button 1 x reset button 2 x temperature sensor headers 1 x reset jumper 1 x Clear CMOS jumper Voltage Measurement Points |
| TPM (Trusted Platform Module ) |
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only) |
| Others |
| Special Features |
Support for GIGABYTE Control Center (GCC) * Available applications in GCC may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications. Support for Q-Flash Support for Q-Flash Plus Support for Smart Backup |
| Bundled Software |
Norton Internet Security (OEM version) LAN bandwidth management software |
| Warranty Information |
| Manufacturing Warranty |
3 Years |
Gigabyte X670E AORUS XTREME DDR5 AMD AM5 E-ATX Motherboard
AMD Ryzen 7000 Series Processors for AMD socket AM5 are supported by the Gigabyte X670E AORUS XTREME Motherboard. With a straight 18+2+2 Phases Digital VRM Solution, it can give performance that is unmatched. The 4x SMD DIMMs in the Gigabyte X670E AORUS XTREME support AMD EXPO and Intel XMP memory modules. It is compatible with DDR5 memory modules with speeds of 6600(OC), 6400(OC), 6200(OC), 6000(OC), 5600(OC), 5200, 4800, and 4400 MT/s. For next-generation storage, it has 4x PCIe 5.0 x4 M.2 Connectors. In order to guarantee VRM power stability and 25110 PCIe 5.0 M.2 SSD performance, it has a Fins-Array III and M.2 Thermal Guard III. By adopting Extended Irregular fins to completely fill every available space and significantly increase surface area, the next generation Fins-Array III provides the highest level of thermal performance. The surface area of a Fins-Array III heatsink is equivalent to two full-size ATX motherboard PCBs, which greatly improves thermal efficiency and heat exchange performance. Additionally, it includes M.2 Connectors with Quick Release & Screwless Design as well as SMD PCIe 5.0 x16 Slot. To minimize throttling and bottlenecking that the high-speed/large capacity of PCIe 5.0 M.2 SSDs may cause, especially under a heavy workload, M.2 Thermal Guard III is built with a 9X enhanced heat dissipation surface. The in-chassis air flow is further improved and the heat convection is optimized by the unique design of the heatsink grooves that face the CPU. The newest Wireless technology, 802.11b, is included in the Gigabyte X670E AORUS XTREME Motherboard. A new dedicated 6GHz band in 11ax Wi-Fi 6E allows for gigabit wireless performance, seamless video streaming, improved gaming, fewer dropped connections, and speeds up to 2.4Gbps. Additionally, Bluetooth 5 offers a 4X greater range than Bluetooth 4.2 and quicker communication. Three years of warranty are included with the Gigabyte X670E AORUS XTREME.
